Test system for testing electrical connections between components and a printed circuit board

ABSTRACT

A test system for testing electrical connections, especially soldered connections, between electronic components and a circuit board to be tested, characterized in that the test system has a communication interface, which by contacting the circuit board enables a data exchange with a data memory or a communication module of the circuit board to be tested, wherein the communication interface is arranged within a housing of the test system freely movably in at least two spatial directions, preferably three spatial directions.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is related to and claims the priority benefit ofGerman Patent Application No. 10 2016 114 144.5, filed on Aug. 1, 2016and International Patent Application No. PCT/EP2017/067810 filed on Jul.14, 2017, the entire contents of which are incorporated herein byreference.

TECHNICAL FIELD

The present invention relates to a test system for testing electricalconnections, especially soldered connections, between electroniccomponents and a circuit board to be tested.

BACKGROUND

EP 0 633 478 A2 discloses such a test system for testing electricalconnections of electronic components with a circuit board.

Such test systems have been successively further developed. Thus, thetest tips are guidable by movable spindles and/or robot arms to thecircuit board to be tested and ascertain, e.g. by resistancemeasurement, whether a soldered connection is correctly positioned andwhether an electrical connection of the electronic components of thecircuit board has succeeded via such soldered connection.

Increasingly, circuit boards are equipped with communication modules,e.g. USB or Ethernet plug connections, in order to enable datatransmission between other circuit boards or external electronic devicesand the electronic components of the circuit boards, especially with oneor more data memories located on the circuit board.

For this, test systems currently applied in such circumstances have nocapability for an automated function testing.

Starting from the state of the art, it is an object of the presentinvention to enable a functional testing of the data paths of thecircuit board to be tested by an aforementioned test system.

The present invention achieves this object by a test system as definedin claim 1.

The test system for testing electrical connections, especially solderedconnections, between electronic components and a circuit board to betested is characterized in that the test system has a communicationinterface, which by contacting of the circuit board enables a dataexchange with a data memory or a communication module of the circuitboard to be tested, wherein the communication interface is arrangedwithin a housing of the test system freely movably in at least twospatial directions, preferably three spatial directions.

Depending on position of the circuit board to be tested, i.e. the testitem or the test circuit board, the communication connection can beoriented and either contacted with contacting regions on the circuitboard or inserted into a communication connection of a communicationmodule, e.g. an Ethernet socket. The movability of the communicationinterface enables an optimal positioning and contacting of the testsystem with the test circuit board.

The data exchange can be utilized for testing the data exchange throughthe test circuit board. Alternatively or supplementally, also data, e.g.a MAC-address or the like, can be downloaded by the test system to thecircuit board.

Other advantageous embodiments of the invention are subject matter ofthe dependent claims.

The communication interface can have at least three electricallyconductive contact tips. A data supply to the circuit board to be testedcan occur via at least a first of the three contact tips, and a datareturn from the circuit board can occur via at least a second of thecontact tips. A reference potential can be applied to at least a thirdof the contact tips.

The contact tips can advantageously be spring biased, in such a mannerthat in the case of application of terminally located pushing action onthe contact tips the contact tips retract partially into thesleeve-shaped housing section. In this way, the danger of mechanicaldamage of the contacting regions on the circuit board to be tested, withwhich contacting regions of the contact tips contact and exchange data,is lessened.

Via at least two of the contact tips, advantageously, a differentialdata supply to the circuit board to be tested can occur and adifferential data return from the circuit board can occur via at leasttwo other contact tips.

The communication interface can be connected fixedly or with a cablewith the test module, which is arranged movably in at least two spatialdirections in the housing of the test module. In a preferred embodiment,the communication interface is arranged with a fixed separation from thetest module and connected mechanically in such a manner that thecommunication interface moves with the test module, to the extent thatthe test module is moved.

The communication interface can in another preferred variant of theinvention be arranged movably in at least one spatial direction,relative to the test module. Thus, it is, for example, possible by meansof the test module to enable a nearing of the contact tips to thecircuit board to be tested, for example, in the x- and y directions, andby means of the communication interface to make an approach in the zdirection. It is also preferably possible to perform a pre-positioning,for example, in the x- and y-directions and, in given cases, also in thez direction, by the test module and to implement a fine adjustment ofthe position of the test pins in one or more spatial directions by meansof the communication interface being displaceable relative to the testmodule. In this way, only signal lines of lesser length are requiredbetween the test module and the communication interface.

The contact tips are preferably and advantageously extendable from andretractable into a housing of the communication interface, especiallypreferably, they are spring biased. Thus, the number of contact tips canbe matched to the array-geometry of the metal contacting regions on thecircuit board. Excess contact tips are retracted and do not damage thesurface of the circuit board. The movability of the contact tips can beimplemented, for example, by spring force magnet systems, electricmotors or spring biased mechanical detent systems, ballpoint pen-detentsystems, and the like.

The test module can have a data memory and/or a communication chip. Thecommunication chip includes at least one data memory and a processor.Advantageously stored in the data memory and/or the communication chipare a number of communication protocols and a processor or a logic chipselects at least one communication protocol from the number ofcommunication protocols. The aforementioned processor can also be theprocessor of the communication chip.

Because of the number of communication protocols in the test module ofthe test system, circuit boards with different communication protocolscan be checked, whereby the circuit boards to be checked, i.e. circuitboards to be tested, can be checked independently of the communicationprotocols provided on the circuit boards.

The test module can have a sensor apparatus, especially a camera or abarcode scanner, for detecting an identifying feature of the circuitboard, especially a barcode, a QR-code or serial number. Based on theidentifying feature, the test system can learn the communicationprotocol present on the circuit board and the communication protocol orthe number of contacting, extended contact tips can, based on suchknowledge, be preselected, and set, based, for example, on the geometryof an array arrangement of metal contacting regions on the circuit boardto be tested.

The test system advantageously includes an electrical current- and/orvoltage source for energy supply of the circuit board to be tested viathe communication interface, wherein the electrical current- and/orvoltage source is arranged movably in at least two spatial directionswithin the housing of the test system. The electrical current- and/orvoltage source can also have a control characteristic.

The test system preferably includes one or more pin like test tips,which scan the circuit board on a top of the circuit board to be testedfor testing the soldered connections between the circuit board to betested and the components arranged on the circuit board to be tested andpopulating it.

The test tips can advantageously have articulations and/or movable axesand be arranged movably, especially capable of traveling, in a number ofdirections in the housing of the test system.

The test module and the communication interface can be arranged suchthat they can approach the circuit board to be tested from below thecircuit board to be tested.

The test module can have one or more test tips for testing theelectrical connection of components of the circuit board, which testtips can be extended in a maximum of one direction from the test module.

The test module can have tool components for handling the circuit board,especially for the removal of mounting aids or for repair of electricalconnections. Such tool components can be e.g. soldering tools or pliertools.

The test module and/or the communication interface can especiallyadvantageously have a transformer module, especially anEthernet-converter, which is connected before the contact tips.

The test module and/or the communication module can have a temperaturemeasuring device for temperature measurement of soldered connections andelectronic components. In this way, a time efficient and comprehensivechecking of the circuit board occurs. Thus, during the checking of thecommunication interface, a temperature checking of components on thecircuit board to be tested can occur, and, in given cases, also theirrepair using the aforementioned tools.

The test module can advantageously have a driver and/or sensor, withwhich the voltage level of the communication protocols can be set andwith which also the electrical currents on the communication lines canbe measured and monitored.

The test module can, additionally, have a relay matrix and/or amultiplexer, with which can be connected the communication lines,however, also other signal sources, especially signal sources from thetest system and/or a computer connected thereto, and/or voltage signalsof the electrical current- and/or voltage source and/or ascertainedmeasurement data, especially measurement data of the temperaturemeasurement as well as interface signals of the communication unit onany of the contact tips of the communication interface.

The test module advantageously includes a self diagnosis function, whichtests one or more functions, especially the functioning of the relaymatrix and/or the multiplexer, the sensor and/or the driver of a secondmultiplexer, the communication chip, the control unit, as well as theelectrical current- and/or voltage source and can report the results tothe test system.

The test module can advantageously have a transformer module with atransformer, with which a galvanic isolation of the communication moduleon the circuit board to be tested is implemented and a matching in thesense of an Ethernet connection is assured, especially independently ofwhether with the communication module a further electrical connection toan Ethernet socket is present or not.

BRIEF DESCRIPTION OF THE DRAWING

The invention will now be explained in greater detail based on a numberof examples of embodiments and with the help of the appended drawing,the figures of which show as follows:

FIG. 1 shows a schematic representation of an axially driven test systemof the invention for testing electronic circuit boards;

FIG. 2 shows a schematic representation of a test module as part of thetest system of the invention;

FIG. 3 shows a schematic representation of a production path formanufacturing a circuit board with a test system 1 of the inventionintegrated in the production path;

FIG. 4 shows a schematic representation of a first variant of acommunication interface as part of the test system of the invention;

FIG. 5 shows a schematic representation of a second variant of acommunication interface as part of the test system of the invention;

FIG. 6a shows a schematic representation of a contacting arrangement ofa circuit board for data exchange with a communication interface of atest system;

FIG. 6b shows a schematic representation of a holding apparatus for themoving in and out of contact tips of the communication interface;

FIG. 7 shows a schematic representation of a second contactingarrangement on a circuit board for data exchange with a communicationinterface of a test system;

FIG. 8a-8c shows a schematic bottom view of the second variant of acommunication interface of the test system of the invention of FIG. 5;

FIG. 9 shows a circuit diagram of an arrangement of a number ofcomponents of a test module with a communication interface of the testsystem of the invention;

FIG. 10 shows a schematic representation of a circuit diagram of an LDOvoltage source with the test module;

FIG. 11 shows a schematic representation of a transformer module for anEthernet communication;

FIG. 12 shows a schematic representation of a rotating communicationinterface; and

FIG. 13 shows a schematic representation of an implementation withdifferent communication protocols.

DETAILED DESCRIPTION

Test systems for testing electronic circuit boards are known per se.They serve for testing the operation of individual electronicscomponents, which are arranged on the circuit board and soldered withsuch. Furthermore, such test systems can serve for testing theelectrical connections of the electronic components, and of theelectronic components among one another and with the conductive tracesof the circuit board.

FIG. 1 shows a test system 1 of the invention for testing electroniccircuit boards, wherein a particular circuit board 6 to be tested has anumber of integrated circuits 8 on its upper side 6 a.

Applied by the test system 1 above the circuit board to be tested is atleast one pin like test tip 2. Preferably, a plurality of pin like testtips 2 are used. These tests tips can preferably be embodied aselectrodes. Movement of the test tip or test tips to and from thecircuit board 6 can occur, for example, using robot arms 3, which areguided above the circuit board 6 to be tested freely in the x-, y- andz-planes, e.g. by movable, telescoping arms or by x-, y- and z-linearlymotorized, articulated arms, movably toward- or away from the contactpoints 7 of the circuit board. At these contacts points 7, resistancevalues can be ascertained.

The robot arms 3 can, for example, be embodied as a linearly guidedcarriage, which has one or more joints, so that the pin-shaped test tips2 are guidable to the circuit board from above or along a plurality ofaxes.

Arranged beneath the circuit board 6 to be tested is a test module 4,which is part of the test system 1 and is movable toward an underside 6b of the circuit board 6. Test module 4 is, thus, arranged analogouslymovable in the x-, y- and z directions relative to the circuit board 6.This is enabled e.g. in the x and y directions by linear guiding, e.g.by linearly guided slide tracks, thus e.g. so-called linear tables. Thiscan occur especially by a roller-, chain- or cable pull guiding. Thus x-and y-linear guiding is then movable in the z direction, thus,perpendicularly to the plane of the circuit board 6, by a robot arm orother linear guiding.

Alternatively thereto, also the circuit board 6 can be arranged movablyrelative to the test module 4 and/or the pin-shaped test tips 2. In suchcase, the test system 1 includes a holder movable at least in the x- andy directions, in given cases, also in the z direction, e.g. by a heightadjustable, linear table.

Test module 4 can, thus, be brought toward the circuit board 6 frombelow. Differently from the case of the individual test needles guidedfrom above for testing the electrical integration of the electroniccomponents with the circuit board 6, the test module performs a testingof function, e.g. the data transmission of a communication module 9 ofthe circuit board 6.

Test module 4 includes a communication interface 5, for communicationwith the communication module 9 of the circuit board 6 to be tested. Bymeans of the communication interface 5, the test system 1 can be used toprogram a data memory 10 arranged on the circuit board 6 to be tested.The test system can, in this way, furnish data to the data memory, forexample, data in the form of a serial number, an IP/MAC-address, as wellas comparative values and/or data sets predetermined in the plant. Twopreferred variants for the communication interface 5 are shown in FIGS.4 and 5.

Communication interface 5 includes in FIG. 4 preferably a housingsection 21 and a number of contact tips 22, which protrude in the formof an array arrangement 23 from an end face 24 of the housing section21. The contact tips 22 of the array arrangement 23 are arranged in arectangular arrangement with a total of nine contact tips. The housingsection 21 sits on a circuit board, which can be that of the test module4 or on a circuit board set apart from that of the test module butconnected via data links as well as energy supply lines and preferablyalso via a fixed mechanical connection with that of the test module 4.

In this way, energy supply and data linking of the communicationinterface in a preferred variant of the invention occurs directly viathe test module 4 and the components arranged thereon or connectedtherewith, so that long data transmission paths are prevented and signalquality in the case of data transmission as well as also transmissionspeed can be increased.

Array arrangement 23 serves for contacting the communication module 9 onthe circuit board to be tested. For this, circuit board 6 includes metalcontacting regions 11. The contacting regions 11 are point shaped orrectangular segments, which are spaced from one another and have thesame arrangement as the contact tips 22 of the array arrangement 23.

Contact tips 22 are spring biased in the housing section, so that in thecase of contacting the contacting regions 11 of the circuit board 6 theycan avoid exerting excess pressure by retreating into the housingsection 21. Thus, because of the flexibility, i.e. the ability of thecontact tips 22 to move in and out of the housing section, bending ofthe contact tips 22 and damage to the contacting regions 11 of thecircuit board 6 can be prevented. Contact tips 22 can be held via atleast one securement element in a retracted position, in which a spring,with which a spring biased contact tip 22 interacts, is compressed andclamped. Thus, an option is provided to change the array arrangement,thus, the number of completely extended contact tips, and, thus, tomatch the number of contacting regions 11 of the circuit board. To theextent that more contact tips 22 than corresponding contacting regions11 are present, then rigidly-projecting, thus, non-spring biased,contact tips would lie on an unprotected surface of the circuit board,whereby damage could occur, both damage of the contact tips 22 as wellas also scratching of the circuit board. This is advantageouslyprevented by the ability of the individual contact tips 22 to extend orretract from or into the housing section 21.

FIG. 2 shows schematically an aforementioned test module 4 connectedwith the communication interface 5. This test module 4 is preferablyapplied for communication by the test system 1, for example, inconnection with a computer, for testing circuit board 6. Additionally,it can, however, also serve via the communication module 5 to tapmeasurement data from the circuit board to be tested and to forward suchto the measuring electronics of the test system. This is performed viaswitching contacts on the test module 4.

These switching contacts enable use of the test module 4 forcommunication, for forwarding measurement data or for a mixed operation.

Via the transformer module 45, which, among other things, also hasswitching contacts, yet more data sources can be connected via thecommunication module 5 directly with the circuit board 6 to be tested.Control signals, which preferably come from the test system 1, control,for example, the switching of relays in the transformer module 45.

Communication interface 5 of FIG. 6a preferably likewise includes ahousing section 31 and a number of contact tips 32, which are located inan array arrangement 33. In the center, a plug 34 is arranged, which isspring biased and in the case of contact with the circuit board retractsa predetermined distance into the housing section 31. In this way,damage of the circuit board 6 or damage of the contact tips is preventedin the case of contacting of the array arrangement 33 on the circuitboard 6.

An array arrangement 23 or 33 within the scope of the invention is anarrangement of a number of contact tips 22 or 32, which contact acircuit board 6 with fixed and defined separations relative to oneanother and perform a data exchange at contact points.

In such case, three contact tips are used in the simplest case. Thisalready enables implementation of data transmission using the so-calledSPI-bus system (Serial Peripheral Interface). In such case, a firstcontact tip 22 or 32 is required for data supply, a second contact tip22 or 32 for data return and a third contact tip 22 or 32 for areference potential.

By enabling more contact tips, other functionalities can be handled.Thus, another reference potential can be tapped. Also a galvanicisolation can be provided. The circuit board can be powered with one ormore voltages. Furthermore, one or more simulations can be performed,e.g. by sending a control command using a contact tip 22 or 32. Also, ameasured value testing of a component of the circuit board 6 can beperformed from a contact tip 22 or 32 as response to the transmittedcontrol command. Another contact tip 22 or 32 can serve as indicationline for testing the operational readiness of the components of thecircuit board 6.

With the communication interface 5, contacting with the contactingregions 11 of the circuit board 6 allows testing the Ethernet connectionof the circuit board into the communication module for the Ethernetconnection.

Especially preferably, the number of contact tips 22 or 32 per arrayarrangement 23 or 33 amounts to nine or ten.

The above-described variants of a communication interface have thespecial advantage that they can be positioned directly by the testmodule 4 and, starting from the test module 4, have short signal- andenergy supply lines to the communication interface 5. In this way, dataloss from long transfer paths is prevented and also an exact signalproduction and signal receipt by the communication interface 5 achieved.

The contacting regions 11 represent the counterpart for the arrayarrangement 22 or 32 of the communication interface 5. The contactingregions 11 can have different forms, e.g. be round or rectangular. Theyare each an uninterrupted metal surface. A plurality of contactingregions 11, e.g. nine contacting regions 11, form a contactingarrangement 12. The contacting regions of the contacting arrangement 12are spaced from one another in the form of a pattern. These spacings ofa contacting region 11 from each neighboring contacting region arepreferably always equally arranged. The contacting regions are free ofother components and/or solder resist or other coatings, which coulddisturb the data connection.

The contacting regions 11 of the contacting arrangement 12 of thecircuit board 6 are preferably arranged in a circularly shaped pattern,preferably arranged on at least two or more circular paths or likewisepreferably in a rectangular pattern, preferably square, on the circuitboard 6.

Corresponding patterns are shown in FIGS. 8a and 7.

FIG. 6b represents in detail a holding apparatus 36 of a contact tip. Asshown, the contact tips can move in and out of the housing of thecommunication interface. The holding apparatus shown in FIG. 6b is, insuch case, only one of a number of variants for holding a contact tip ina retracted position in the housing. In such case, the contact tip 32has a plate-shaped formation 36 a movably accommodated in a passageway36 d. A spring 36 b presses against the formation 36 a, whose movementis limited by a stop 36 e, which protrudes inwardly into the passageway.For holding the contact tip 32 in a retracted position, an electromagnet36 c is provided, which pulls the disk-shaped formation of the contacttip upon the activating of the electromagnet. To the extent that theelectromagnet 36 c is not activated, the contact tip is exclusivelyspring biased. Extending from the contact tip is a cable 36 f, whichserves for signal- and/or energy transmission. The holding apparatus isnot limited to FIG. 6b , but, instead, can also be used for all othervariants of the above-described communication interfaces.

The contacting regions 11 are preferably gold coated or tinned, in orderto provide a better data link.

A corresponding contacting arrangement 12 is preferably arranged on thecommunication path in the vicinity of the communication module 9 of thecircuit board 6, so that communication with the individual components ofthe circuit board and a loading of data e.g. into the data memory of thecircuit board can occur by detouring around the communication module 9,thus, e.g. the Ethernet socket.

A circuit board 6 to be tested having a communication module, which isembodied as an Ethernet interface, can in the case of a testing in amanner not of the invention, be contacted by any test system via astandard Ethernet socket with a communication interface of the testsystem.

In the context of the present invention, it is, however, provided thatsuch a testing occurs in an automated manner, wherein plugged connectionvia an Ethernet standard socket is unnecessarily complicated for suchpurpose. An automated testing of such an Ethernet interface has not beenoffered by established companies, which develop automated test systems,e.g. for testing solder contacts.

Communication interface 5 can preferably have one or more components,which emulate the components of the communication module 9 of thecircuit board 6. This component is arranged in FIGS. 4, 5 and 6 a in thehousing section 21 or 31 and can be embodied, for example, astransformer module 45, also called converter. Such a transformer modulecan preferably be a so-called Ethernet Magnetic Transformer. Acorresponding transformer module is most often also integrated in anEthernet plug, which, however, can be bypassed by contacting of thecommunication interface 5 with contact areas 11 of a contactingarrangement 12 on the circuit board 6.

Thus, the communication module can be connected with the circuit board 6and exchange data with the components via the array arrangement 23, 33without large signal loss before and after the transforming due to longdata links.

Because of the functionally equal simulation of the components of thecommunication module 9 of the circuit board by the components of thecommunication interface 5 of the test module 4, a secure communicationwith the processor unit, the data memory and additional components onthe circuit board 6 to be tested can be assured, without it depending onwhether the bridged over Ethernet socket of the circuit board 6 has notransformer module, a transformer module or a number of transformermodules interconnected with one another in series or In parallel.

After the read-out of the type of Ethernet socket on the circuit boardby the test system e.g. based on a barcode on the circuit board, thetest system can select a corresponding components circuit, whichcorresponds to the circuit of the Ethernet socket, so that an equal dataexchange is enabled between the test system 1 and the circuit board 6,in spite of the bridging over, thus as if the test system were connectedtherewith via the Ethernet socket of the circuit board 6.

Thus, for example, a data exchange can occur at a typical datatransmission rate of 10 to 100 Mbit/s

Shown in FIGS. 6a and 8a is a variant of an array arrangement 33 with aplug 34. In this variant, the plug is embodied as a centering plug andthe contact tips 32 are arranged spaced from one another along a lineextending radially to this centering plug.

The contact tips 32 can be capable of being moved out, and, for example,based on a locating mechanism, when required, be moved out. Thus,depending on component type of the circuit board, the not-requiredcontact tips 32 can be retracted.

The component type can be identified based on a barcode located on thecircuit board. The barcode can be detected by means of a camera 13located on the test module 4. Depending on the information in thebarcode, then the communication interface 5 and associated components,as well as other components of the test module 4 can be correspondinglyoperated and, especially, placed in readiness.

Because contact tips can be retracted, less space on the circuit boardto be tested is required for contact areas 11, so that material of thecircuit board can be saved and an optimized component arrangementachieved on the circuit board.

The centering by the centering plug can especially work together with anarrangement of contact areas 11 on a circuit board 6 as shown in FIG. 8c.

Furthermore, it is, in such case, advantageous that the arrayarrangement, thus, the arrangement of the pin-shaped metal contact tips22, 32, is arranged rotatably around an axis defined by the centeringplug. Then, the pin-shaped contact tips can better approach the contactareas 11 and make contact with them, so that advantageously the numberof contact areas 11 can be reduced. The rotatability of the arrayarrangement is also advantageous in the case of rectangular arrayarrangements of the contact tips, such as shown e.g. in FIG. 4.

The rotatability of the array arrangement 23, 33 as shown in FIG. 12 andFIG. 8c is, additionally, advantageous, since, in this way, circuitboards 6 can be supplied with different orientations, thus, delivery inlongitudinal- or transverse direction of the circuit board, and testedin the test system 1, without requiring that the circuit board firstmust be brought into position by rotation. Rather, by rotation of thearray arrangement 23, 33, its tips 22, 32 can be oriented according tothe orientation of the circuit board. A twisting of the circuit board orits supply in the test system with a non-optimal orientation is thus ofno consequence for the testing and the transferring of data.

The rotation of the array arrangement, e.g. by rotatable seating of thearray arrangement, can, thus, both be implemented advantageously in thecase of the present invention for a rectangular array arrangement of thecontact tips as well as also for a linear arrangement of the contacttips.

By furnishing various data sets, the test module 4 can communicate viadifferent communication protocols with the circuit board 6 to be testedand the thereon located communication modules 9 and data memory 10, suchas shown in FIG. 13. Thus, depending on type of communication, anindividualized supplying of communication protocols can occur and, ingiven cases, there can be a switching between types of communication.For this, no additional systems are enabled, but, rather, the datatransmission can occur during the testing of the solder locations andelectronic components.

In this way, depending on need, different communication protocols can beapplied by the test system for the circuit board 6 to be tested and/orthe circuit board 6 can be tested for the presence of thesecommunication protocols. Such communication protocols include e.g. I2C,SPI, USB, Ethernet, Profibus and/or UART.

The levels of the drivers are, in such case, preferably settable viasoftware stored in the data memory or a logic chip of the test module 4or directly via the test system 1. Thus, the test module 4 cancommunicate via the communication interface 5 not only with differentcommunication protocols but, instead, can also match the voltage levelof the communication signals to the level of the circuit board 6 to betested.

Furthermore, there is stored in the data memory or the logic chip of thetest module 4 a self diagnosis program, with which a diagnosis of thetest module 4 and the communication interface 5 can occur and which canbe executed by a processor or a logic chip of the test module 4.

In the context of the present invention, the communication interface 5is referred to as a first component for function checking, with which bysending and receiving of communication data to and from the circuitboard 6, the correct data transmission of the circuit board 6 is testedby the test system 1; especially, associated with the circuit board 6, aprocessor unit, which manages a data memory, is tested by the testsystem 1. Other components, which preferably can be applied in the caseof the present invention, will now be described in the following.

Test module 4 includes at least one or more extra components in thecontext of the present invention, an example being support element 18serving for locating items between the circuit board 6 and the testmodule 4 and, in given cases, for supporting the circuit board 6 againstsagging.

A third component, which can be arranged on the test module 4, is acamera 13 for image capture in the visible spectral range. Camera 13 canfulfill different functions.

It can serve for determining the position of the circuit board 6 to betested.

It can alternatively or supplementally also examine the circuit board 6to be tested for the presence of components, which should be on thecircuit board.

Camera 13 can, also, alternatively or supplementally, register a barcodeor a serial number of the circuit board 6, such that the circuit boarddata-sets and control-programs determined based on this barcode areretrieved from a data memory and initiated. These can include, amongother things, particular specifications for examining the circuit board6, and components arranged thereon, or the scope of the data, whichshould be transmitted to the data memory of the circuit board 6 with thehelp of the communication interface.

Camera 13 can, additionally, check for the presence of solder locations.

Other functions, for example, other diagnostic functions, can also beexecuted by the camera.

A fourth component of the test module 4 can comprise, for example, ametal, pin-shaped test tip 20 e.g. for testing by resistance measurementthe solder contacts arranged underneath. In contrast with the test tips2, which approach the circuit board 6 from above, test tip 20 can bearranged on the test module 4 rigidly with the test module 4 or onlymovable in one direction, especially outwardly movable. In this way, themechanical complexity of the metal test tip 20 is lessened.

Alternatively or supplementally to mechanical functions or diagnosticfunctions by the aforementioned component or the aforementionedcomponents, also exclusively a loading of data e.g. communicationprotocols can occur through the communication interface 5. Because theloading of the data into the data memory 10 of the circuit board 6 to betested occurs simultaneously with the testing of the solderedconnections e.g. by the test tips 2, a time saving is achieved duringthe quality checking.

The loading of the data can occur, for example, as a type of basicprogramming. The circuit board 6 to be tested can especially be appliedin a measuring device of automation technology. Data can be transmittedto the data memory 10 as a function of the particular measuring device,the field of application of the measuring device and the production pathfor manufacturing of the measuring device. The data transmission canoccur specifically for the components of the circuit board, so that datafor control, testing and/or identification of the individual componentsor assemblies of the circuit board 6 can be downloaded from the datamemory of the test module 4 via the communication interface 5 and thecommunication module 9 to the data memory 10 of the circuit board.

Alternatively or supplementally to the aforementioned components, thetest module 4 can also comprise one or more tool components 50, forexample, a soldering element 51 for forming a soldered connection or apliers 52. Other tool components e.g. a screw driver and the like canlikewise be provided. Through use of the tools, a simple repair of thecircuit board 6 to be tested can be made soon after detection of adefect by the upper test tips 2 or populating aids can be removed.

Additionally, the test module 4 can also have an electrical current-and/or voltage source for power supply of the tool components or thecomponents for function checking.

Test system 1 includes a data memory 35 having a corresponding testprogram stored therein. This test program controls use of the supportelement 18, the contact tips 22, the test tip 20, and/or, in givencases, further tools 50, 51, 52 and their positioning. In this way,different circuit boards to be tested 6 with different separations ofthe components can be tested and supplied with data.

In addition to the solder location testing performed on the top by thetest tips 2, in a variant of the present invention, the test module 4performs a functional testing of individual components.

The aforementioned test components can be arranged individually orespecially preferably together on the test module 4. The latter isadvantageous, since then a fixed separation is maintained.

Because of the movability of the test module 4 below the circuit board 6in the x-, y- and z directions, simultaneously with quality checking ofthe connections of the electronic components with the lines of thecircuit board, also a function checking of the various components of thecircuit board to be tested can occur, which means a time saving and alsoa spatial savings, since no additional test system is needed.

A further aspect of the present invention is the voltage- and/orelectrical current supply of the test module 4 and the componentsconnected therewith, thus, the communication interface 5, as well as thecircuit board 6 to be tested, however, also other components, e.g. toolcomponents, such as pliers or solder elements or one or more cameras. Inthe case of previous test systems, the power supply occurs from anelectrical current- and/or voltage source away from the test system,thus, spatially removed from the test specimen, and the circuit board 6to be tested.

According to the invention, the electrical current- and/or voltagesource 14 is part of the test system 1 and especially a component of thetest module 4. In this way, a voltage drop because of long lines 17 isprevented. The electrical current- and/or voltage source can becontrolled by a control unit 15 according to a program or by manualinput.

Test system 1 is bounded by a housing 16. While the test module 4, aswell as the communication interface 5 and the electrical current- and/orvoltage source 14 are movably arranged in the housing, the control unit15 is preferably fixedly arranged in the or on the housing 16 of thetest system 1 or outside of the housing 16.

In a special embodiment of the invention, the contact tips 22, 32 aredirectly connected with the electrical current- and/or voltage source 14via an electrical current supply line. The electrical current- and/orvoltage source 14 can be supplied from the outside, thus, outside of thehousing 16 of the test system 1, with energy, and, likewise with controlcommands from the outside, be set to a voltage delivery value.

Using the control unit 15, both the voltage supplied to the test module4 and especially to the communication interface 5 and the electricalcurrent level supplied to the test module 4 and especially to thecommunication interface 5 can be set or both the supplied electricalcurrent level as well as also the supplied voltage can be set. Thus,especially the contact tips 22, 32 can be operated with an electricalcurrent having a predetermined voltage and/or a predetermined electricalcurrent level.

Electrical current- and/or voltage source 14 in the case of the presentinvention is a component, which generates from a larger voltage or alarger electrical current level, independently of the size of thesupplied voltage or electrical current level, a discrete lower voltage-and/or electrical current level value.

For checking the voltage value, which does arrive at the contact tips 22or 32, the electrical current- and/or voltage source 14 can preferablybe connected with the contact tips via a read back line, a so-calledsense line. In the case of the present electrical current- and/orvoltage source 15, the output voltage or a part thereof is compared witha reference voltage and so adjusted that even in the case of fluctuatingload the output voltage to the circuit board 6 to be tested remainsconstant. This state is, however, most often present only in the idealcase. Therefore, the voltage to be compared with the reference voltageis ascertained by means of the read back line in the vicinity of theload, thus, at the contact tips 22 or 32, thus, at the end of the supplylines with the fluctuating voltage drop. The voltage drop on the supplylines is, in this way, controlled out and the voltage on the load, thus,at the contact tips of the communication interface 5, remains constantalso in the real case. The aforementioned line for each contact tip canbe connected in parallel with the voltage input of the test tip, so thatthe electrical current- and/or voltage source 14 can cancel the voltagedrop of the line resistance. The voltage produced by the electricalcurrent- and/or voltage source 14 can, thus, after reconciliation withthe readback values, be brought to the desired value. In this way, thevoltage drop through the line path between the contact tips 22, 32 andthe electrical current- and/or voltage source 14 can be canceled and, ingiven cases, also voltage fluctuations can be canceled.

On the whole, the power supply from the electrical current- and/orvoltage source can be controlled by a program, which preferably isstored in the data memory of the test module 4. A preferred type ofprogrammable voltage source is also known as an LDO (low-drop-outvoltage regulator) and can be applied in the case of the presentinvention as a preferred form of an electrical current- and/or voltagesource 14.

The electrical current- and/or voltage source 14 is so designed that itcan react and adjust extremely rapidly to load changes on the circuitboard to be tested, preferably within some nano seconds. This ispreferably required, when in the case of the circuit board 6 to betested of concern is a component with fast microprocessors with fastcommunication and memory chips, which exhibit these dynamic loadchanges. This function is preferably implemented with chips with fastcontrol properties and/or with capacitors, which can bridge over veryshort energy peaks.

The electrical current magnitude values can in an additional preferredvariant of the invention likewise be read-out and limited byreconciliation with a stored data set. This data set can likewisepreferably be stored in the data memory of the test module 4 and/or ofthe control unit 15.

A circuit diagram for a preferably applied electrical current- and/orvoltage source 14 is shown in the circuit diagram of FIG. 10, whoseparts are discussed as follows: The LDO shown in FIG. 10 is a so-calledlow drop out voltage regulator. The Communication Module is acommunication module, which controls the LDO and represents theconnection to the test system 1. The LDO can be located in the testmodule 4 or in the communication interface 5. FIG. 10 shows it in thetest module 4.

FIG. 9 shows the essential components of the communication module. Thecore is formed by the communication unit 25. It provides the differentcommunication protocols and/or converts a protocol e.g. USB coming fromthe test system into another protocol. A multiplexer 27 (MUX), which isconnected after the communication chip 28, can switch the individualcommunication signals to any contact tip 2, 32 of the communicationinterface 5. That, in turn, brings flexibility in the case of theformation of the contact points 7, and the array arrangement 23, on thecircuit board 6 to be tested. Connected after the multiplexer 27 (MUX)can be a driver/sensor 29, which can adjust the signal level of thecommunication signals. Thus, the flexibility of the communication unit25 is increased, since matching to different signal levels and, thus, todifferent voltage technologies of the circuit board 6 to be tested isprovided. Furthermore, the driver/sensor 29 can also contain a sensor,which measures the electrical current flowing through the communicationlines and in the case of deviations e.g. triggers an error report orperforms a shutdown. Control of the communication chip 28, themultiplexer 27, the driver/sensor 29 and the downstream relay matrix 24is done by a logic chip 26, which, in turn, is connected with the testsystem. Logic chip 26 can be implemented by an FPGA, a microcomputer orother chip with logic functions. An expanded relay matrix 24 increasesthe flexibility of the test module 4 by allowing switching of a numberof signal sources, voltage supplies, communication interfaces, andmeasurement data as well as the interface signals from the communicationunit 25 to any of the contact tips 2, 32 of the communication interface5. This is true for the electrical current/voltage source 14 of the testmodule 4 and also for power supply units of the test system 1 connectedwith the test module 4. In such case, also a mixed or combinatorialswitching is an option. The relay matrix 24 can likewise be operated bythe control unit 26.

The transformer module 45 is preferably a component of the test module 4and can be connected via the communication interface 5 with a circuitboard 6 to be tested. The circuit board to be tested contains acommunication module 9, which preferably supports Ethernet or Profinetcommunication. Magnetics 46, thus, the transformer, of the transformermodule 45 is dimensioned in such a manner that it implements a galvanicisolation for communication module 9 and an electrical fitting in thesense of an Ethernet connection. Additionally, the magnetics 46 of thetransformer module 45 is so designed that an Ethernet/Profinetcommunication with 100 Mbit/s is possible independently of whether withthe communication module 9 via an electrical connection 48 a so-calledEthernet socket 47 is mounted or not. It is likewise insignificantwhether an Ethernet socket 47 mounted on the circuit board 6 to betested contains constructionally related magnetics or not.

In addition to the above-described components, the test module 4 canalso have a thermography system, preferably in the form of an infraredcamera 130, or a temperature sensor, preferably a contactlesslymeasuring temperature sensor. The variant of the temperature sensor is,however, less preferable, because of the smaller registration range ofthe temperature measurement. The infrared camera, in contrast, permits atemperature measurement of individual components of a circuit board 6 tobe tested and their connection with the circuit board 6. The temperaturemeasurement of the IR camera can occur by freely positioning the testmodule 4 with the IR camera 30 along the surface of the circuit board 6to be tested at certain preferred locations. The temperature measurementcan preferably occur contactlessly. Alternatively or supplementally tothe temperature measurement through the infrared camera, also a test tiphaving a temperature sensor can perform a temperature measurementprovided by contacting the circuit board. This variant requires,however, a greater constructive and mechanical control effort connectedwith a time-consuming measuring in comparison with the IR camera.

FIG. 3 shows a production path 100 for manufacture and testing ofcircuit boards 6 of the invention, which can be used preferably inmeasuring devices of automation technology, e.g. in measuringtransducers.

Production path 100 includes a station 101 for providing a circuit boardfoundation. The circuit board foundation can already have conductivetraces.

The production path 100 includes a transport apparatus 102, for example,a conveyor belt, with which the circuit board foundation is transportedfurther in a transport direction R from station to station.

Starting from the station 101, in which the providing of the circuitboard foundation occurs, such is transported further to a station 103for populating the circuit board foundation with electronics components,wherein at least one of these components is an intelligent component,which is embodied, for example, as communication module 9 forcommunication with other electronics devices located away from thecircuit board. A further intelligent component is a central processorunit, which is part of the circuit board 6 to be tested and whichmanages the data of the data memory 10. In this way, the circuit board 6is formed from the circuit board foundation. The populating can occure.g. with the assistance of masks previously applied on the circuitboard foundation.

Following the station 103 for populating the circuit board, the circuitboard 6 is transported into a soldering oven 104, where a soldering ofthe electronics components with the circuit board foundation occurs.

After passing through the soldering oven 104, a final check of thereadied circuit board 6 by the test system 105 a and 105 b occurs. Insuch case, the test system 105 a simultaneously

a) checks the electrical connection of the solder locations between thecomponents and the circuit board, and

b) performs a functional testing of one or more of the intelligentcomponents, thus, e.g. the communication module 9.

The aforementioned functional testing preferably includes a functionchecking of the communication module 9, a programming and/or a testingof the programming of the data memory 10 of the circuit board 6, and achecking of the data link starting from the communication module to thecentral processor unit of the circuit board 6.

The complex testing of data in the data memory, the processor unit andthe communication module cannot occur through individual test tipsapplied from the top of the circuit board. For this, the above-describedcommunication interface 5 is needed preferably with the above-describedembodiments of the respective array arrangements 23 or 33 of a number ofcontact tips 22 or 32.

The invention claimed is:
 1. A test system for testing electricalconnections between electronic components and a circuit board to betested, the test system comprising: a housing; a communicationinterface, which by contacting the circuit board to be tested enables adata exchange with a data memory and/or a communication module of thecircuit board to be tested, wherein the communication interface isarranged within the housing of the test system movably in at least twospatial directions, and a test module that is arranged movably in atleast two spatial directions in the housing of the test system, whereinthe test module includes a data memory and/or a communication chip inwhich a plurality of communication protocols are stored, and wherein thetest module further includes a processor or a logic chip for selectingat least one communication protocol from the plurality of communicationprotocols, wherein the communication interface is connected tightly orwith a cable to the test module.
 2. The test system as claimed in claim1, wherein the communication interface includes at least threeelectrically conductive contact tips.
 3. The test system as claimed inclaim 2, wherein a data supply to the circuit board to be tested occursvia at least a first contact tip of the at least three contact tips anda data return from the circuit board occurs via at least a secondcontact tip of the at least three contact tips.
 4. The test system asclaimed in claim 3, wherein a reference potential is applied to at leasta third contact tip of the at least three contact tips.
 5. The testsystem as claimed in claim 2, wherein the communication interfacefurther includes a housing section, wherein the at least three contacttips are disposed at least partially in the housing section, and whereinthe at least three contact tips are spring biased such that a pushingaction on the at least three contact tips causes the at least threecontact tips to retract partially into the housing section.
 6. The testsystem as claimed in claim 1, wherein the communication interfaceincludes at least four electrically conductive contact tips, and whereina differential data supply to the circuit board to be tested occurs viaat least two of the at least four contact tips and a differential datareturn from the circuit board occurs via at least two other of the atleast four contact tips.
 7. The test system as claimed in claim 1,wherein the communication interface is arranged movably in a spatialdirection relative to the test module.
 8. The test system as claimed inclaim 1, wherein the test module includes a camera or a barcode scannerfor detecting an identifying feature of the circuit board, including abarcode, a QR-code, or a serial number.
 9. The test system as claimed inclaim 1, further comprising: an electrical current and/or voltage sourcefor energy supply of the circuit board to be tested via thecommunication interface, wherein the electrical current and/or voltagesource is arranged movably in at least two spatial directions within thehousing of the test system.
 10. The test system as claimed in claim 1,further comprising: one or more pin-like test tips embodied to scan thecircuit board on a top of the circuit board for testing solderedconnections between the circuit board and the electronic components. 11.The test system as claimed in claim 10, wherein the one or more testtips have articulations and/or movable axes and are arranged movably andenabled to travel in three directions in the housing of the test system.12. The test system as claimed in claim 1, wherein the test module andthe communication interface are arranged such that they can approach thecircuit board from below the circuit board.
 13. The test system asclaimed in claim 1, wherein the test module includes one or more testtips for testing electrical connection of components of the circuitboard, which test tips are extendable in a maximum of one direction fromthe test module.
 14. The test system as claimed in claim 1, wherein thetest module includes tool components for handling the circuit board,including the removal of mounting aids or the repair of electricalconnections.
 15. The test system as claimed in claim 1, wherein the testmodule and/or the communication interface include a transformer moduleconnected before the at least three contact tips.
 16. The test system asclaimed in claim 1, wherein the test module and/or the communicationmodule include a temperature measuring device for temperaturemeasurement of soldered connections and electronic components.
 17. Thetest system as claimed in claim 1, wherein the test module includes adriver and/or sensor with which the voltage level of the communicationprotocols can be set and with which also electrical currents and/orvoltages on/in communication lines can be measured and monitored. 18.The test system as claimed in claim 1, wherein the test module furtherincludes a relay matrix and/or a multiplexer with which can be connectedcommunication lines from the communication chip; signal sources from thetest system and/or a computer connected thereto; voltage signals of theelectrical current and/or voltage source; ascertained measurement data,and interface signals of a communication unit on any of the contact tipsof the communication interface.
 19. The test system as claimed in claim1, wherein the test module includes a transformer module with atransformer with which a galvanic isolation of the communication moduleon the circuit board to be tested is implemented and a matching in thesense of an Ethernet connection is assured, independently of whetherwith the communication module a further electrical connection to anEthernet socket is present or not.